
INTERFACE DESIGN FOR SEMICONDUCTORS
Wherever two materials meet inside a chip, a vanishingly thin layer decides how well heat escapes, how well the materials bond, and whether the device can be made at all.
Kamalytics designs that layer by simulation, then proves it on your process.
THE INTERLAYER
Modern devices are built from materials that were never meant to sit together. At every meeting point, a layer only a few atoms thick determines how the whole device performs.
Today that layer is still found by trial and error. We replace the guesswork with design.
It controls how freely heat can leave the device.
It decides whether two unlike materials stay joined.
It has to withstand growth, stress and years of service.
It has to be something a real process can make.
THE PRODUCT
Our product is the best interlayer for one interface, delivered as evidence arrives. A fixed price per interface, and a design you can build.
For your two materials, we rank candidate interlayers and show the risks and trade-offs, so you know which experiments to run first.
The best interlayer is grown and measured on your own process, against your own baseline and requirements.
Once it reproduces, the recipe is yours to license and take into production.
THE ENGINE
Our engine builds candidate interlayers atom by atom and predicts how each one will behave, before anything is grown. It weighs heat flow, adhesion and stability together, applies your process limits, and names the experiments worth running.
Every result feeds back in, so each new interface is faster to solve than the last.
Propose
Build
Predict
Screen
Test
Learn
GET IN TOUCH
Tell us about the materials you are joining. A project brief is optional; even just your contact details is enough to start.